Technology: Bioelectrical sensing, bioelectrical authentication and handheld device security Patent Status: UK patent application filed – GB2623434.4 Technology Overview: Synavex AI is a proposed bioelectrical authentication technology designed to authenticate users through brief physical contact with a handheld computational device. The invention describes a system that acquires and analyses bioelectrical signals associated with the user through contact with conductive surfaces integrated into the device. The proposed system incorporates cranial/forehead electrodes using indium tin oxide (ITO) as a transparent conductive sensor material. ITO is an established commercially used material in smartphone touchscreens and other electronic display technologies, making it relevant to exploring integration with existing consumer electronics manufacturing processes. Its conductive and transparent properties offer potential for incorporating sensing surfaces into device designs. The proposed system combines cranial electrodes, signal acquisition electronics and signal-processing methods to capture and evaluate bioelectrical measurements for user authentication. The objective is to enable convenient device access through a short, natural interaction without requiring a separate wearable headband or external biometric accessory. Potential Applications: - Mobile phone unlocking and device access - Banking authentication and secure access to mobile banking applications - Financial transaction authorisation - Biometric identity verification - Secure access to computational devices - Consumer electronics and personal device security - Bioelectrical authentication interfaces - Digital payment security Commercial Opportunity: The technology may be of interest to smartphone manufacturers, banking and financial technology companies, consumer electronics businesses, biometric security developers and Tier-1 electronic component suppliers exploring alternative authentication technologies. Supporting Documents: The patent application document and technical summary have been uploaded to PatentFlip for interested companies to review and evaluate.